Suzhou, China, December 16, 2020—Winbond Electronics, a global leader in semiconductor storage solutions, today announced that its high-performance, low-power 1Gb LPDDR3 DRAM is used in Qingwei’s new artificial intelligence chip for high-bandwidth applications. The field has once again achieved impressive results.
The latest TX510 SoC released by Tsingwei Intelligence is a highly advanced AI edge computing engine, which has been optimized for functions such as 3D sensing, face recognition, object recognition, and gesture recognition. TX510 is suitable for applications that require rapid image detection and recognition, including biometrics, video surveillance, smart retail, smart home automation, and advanced industrial automation.
Winbond’s LPDDR3 DRAM provides the highest bandwidth of 1866Mb per second, uses 1.2V/1.8V dual power supply, and has power saving functions (such as deep power saving mode and frequency stop, etc.), supporting TX510 to provide excellent speed in AI imaging applications And precision.
An innovative architecture is implemented in the TX510 SoC: a 32-bit RISC processor, a reconfigurable neural network engine, a reconfigurable general computing engine, an image signal processor, and a 3D sensing engine are included. At the time of shipment, the TX510 is integrated with Winbond’s 1Gb LPDDR3 DRAM chip in the same 14mm x 14mm TFBGA system-in-package (SiP). The SiP can achieve up to 1.2 TOPS (trillion operations per second) of processing capacity, perform accurate face recognition in less than 100 milliseconds (the false acceptance rate is one in ten million), and can be less than The features are compared with facial information in 100,000 databases in 50 milliseconds. The peak operating power consumption of the chip is only 450mW, and the power consumption in static mode is only 0.01mW.
“The performance evaluation of Winbond LPDDR3 DRAM shows that it has advantages in terms of speed and power consumption.” Qingwei Intelligent CEO Wang Bo said, “But it is also important that Winbond helped us when we developed TX510. Provided the support and expertise that allowed us to integrate DRAM chips into SiPs so that we can maintain high performance and signal integrity while maintaining thermal management.”
Winbond said: “In its close technical cooperation with Qingwei Intelligence, Winbond’s high-performance and low-power DRAM has assisted TX510 to demonstrate extremely high performance, setting a new benchmark for this type of innovative AI chip.”
Winbond LPDDR3 DRAM has been mass-produced. For more information, please visit www.winbond.com.
For more information about TX510, please visit www.tsingmicro.com.
About Qingwei Intelligent
Qingwei Intelligence is a leader in reconfigurable computing chips, providing chip products and solutions based on the end-side and extending to the cloud side. The core technical team comes from the Institute of Microelectronics of Tsinghua University. It has been engaged in chip research and development for 13 years. It has both chip, software, algorithm and system research and development capabilities. It has won the National Technology Invention Award, China Patent Gold Award, ACM/IEEE ISLPED Design Competition Award and many other awards. .
Reconfigurable computing is a new chip architecture technology that can flexibly reconfigure hardware resources according to different applications or algorithms. Based on reconfigurable computing technology, Tsing Micro’s mass-produced smart voice chip TX210 in June 2019 is the first commercial use of a reconfigurable chip. In July 2020, mass-produced the world’s first multi-modal smart computing chip TX510.
The company has already cooperated with hundreds of well-known smart phone, home furnishing, financial payment and smart wearable device manufacturers. In the future, it will continue to leverage the advantages of reconfigurable technology in software and hardware programming to cover more application areas from the cloud side.
About Winbond
Winbond Electronics is a professional memory integrated circuit company whose main business includes product design, technology research and development, wafer manufacturing, marketing and after-sales service, and is committed to providing customers with a full range of niche memory solutions. Winbond’s products include niche dynamic random access memory, mobile memory, and coded flash memory, which are widely used in communications, consumer electronics, industrial use, automotive electronics, and computer peripherals. Winbond is headquartered in the Central Science Industrial Park in Taiwan, and has subsidiaries and service locations in the United States, Japan, Israel, China, and Hong Kong. Winbond has a 12-inch wafer fab in Zhongke, and is currently building a new fab in Nanke Kaohsiung Park. In the future, it will continue to introduce self-developed process technology to provide partners with high-quality memory products.
