On October 15, the Shanghai Stock Exchange officially accepted the listing application of Huahai Qingke Co., Ltd. (hereinafter referred to as “Huahai Qingke”) on the Science and Technology Innovation Board.
According to the data, Huahai Qingke was established in 2013. It is a high-end semiconductor equipment manufacturer with core independent intellectual property rights. It is mainly engaged in the research and development, production, sales and technical services of semiconductor special equipment. Its main products are chemical mechanical polishing (CMP) equipment. .
Break the foreign technology monopoly
It is reported that the CMP equipment produced by the company can be widely used in 12-inch and 8-inch integrated circuit production lines. The overall technical performance of the product has reached the international advanced level. It is currently the only company in China that provides 12-inch CMP commercial models for integrated circuit manufacturers. of high-end semiconductor equipment manufacturers.
According to the prospectus, the core R&D team of Huahai Qingke has successively undertaken and jointly undertaken two “National Science and Technology Major Projects (02 Special Projects)” and three national-level major projects/subjects, aiming at nano-level polishing, nano-particle ultra-clean cleaning, The core key technologies of CMP equipment such as nano-precision film thickness online detection, big data analysis and intelligent control have achieved effective breakthroughs and system layouts, breaking the technological monopoly of foreign giants, and truly realizing domestic substitution in the field of CMP equipment in the domestic market.
From 2017 to 2019, CMP equipment accounted for 73.69%, 89.01%, and 92.39% of the total revenue of Huahai Qingke, and 80.73% of the revenue in the first half of 2020. During the reporting period, the top five customers of Huahai Qingke accounted for 98.22%, 99.09%, 94.96% and 99.57% respectively.
It is understood that Huahai Qingke CMP equipment has shipped a total of 43 units, with 26 units on hand. The equipment has been widely used in SMIC, YMTC, Hua Hong Group, Intel, Changxin Storage, Xiamen Lianxin, Guangzhou Yuexin , Shanghai Jita and other advanced integrated circuit manufacturers at home and abroad in the large production lines.
Raised 1.5 billion yuan to increase the main business
It is reported that Huahai Qingke plans to raise 1.5 billion yuan this time, which is planned to be used for all the projects related to the company’s main business and the funds needed for the development of its main business, including high-end semiconductor equipment (chemical mechanical polishing machine) industrialization projects, high-end semiconductor Equipment research and development projects, wafer regeneration expansion and upgrading projects, and supplementary working capital.
Source: Screenshot of prospectus
Among them, the high-end semiconductor equipment (chemical mechanical polishing machine) industrialization project has a planned total investment of 540.44 million yuan and a construction period of 15 months. It will build 1 production plant, 1 testing workshop and related supporting facilities, with a total construction area of 53,000 square meters. The designed production capacity is 100 chemical mechanical polishing machines (including thinning equipment) per year. After the completion of the project, the company will further expand the production capacity of high-end semiconductor equipment (mainly high-end CMP equipment and all-in-one thinning and polishing machine) and the R&D and service capabilities in chemical mechanical polishing related fields.
At present, the project has obtained the construction permit and started construction in March 2020, and the construction period is expected to be 15 months. As of the signing date of this prospectus, the construction of the construction and installation project has completed the capping of the main structure. It is expected that the trial operation of the production line will start before the end of 2020, and the overall project acceptance will be completed and officially put into production in the first half of 2021.
The high-end semiconductor equipment R&D project plans to invest a total of 311.85 million yuan. The project carries out a series of technical research and development topics, innovatively researches and develops a number of key technologies and systems for advanced semiconductor manufacturing CMP and thinning for 14nm and below processes, and develops corresponding complete sets of advanced processes.
In addition, Huahai Qingke has opened up the entire wafer regeneration process and will start small-scale production in 2020. The wafer regeneration, expansion and upgrading project takes the high-end CMP equipment independently developed and produced by the company as a platform, cooperates with the CMP process that has been developed and maturely applied, and is equipped with new single-wafer cleaning equipment to build a larger-scale production line for expanding and upgrading wafers Recycling business. The total planned investment of the project is 357.9 million yuan, the construction period is 15 months, and 46 sets of new production equipment and instruments will be added. After the project is completed, it will have a monthly production capacity of 100,000 12-inch recycled wafers.
Regarding the future development plan, Huahai Qingke said that in the next 3-5 years, the company will adhere to the needs of the integrated circuit industry as the guide, take independent research and development and industrial application as the key breakthrough, and strengthen the close cooperation with upstream and downstream core enterprises to form an integrated The technical layout and market positioning of the coordinated development of key circuit manufacturing equipment, consumables and technical services, and wafer recycling and foundry business, based on domestic and global, strive to increase market share and influence in the field of global integrated circuit equipment, and develop into an internationally renowned Integrated circuit high-end equipment and technical service provider.