Join hands with Xunxin, Plasign released SiP system-in-package equipment DA801S

Join hands with Xunxin, Plasign released SiP system-in-package equipment DA801S

The semiconductor industry is slowing down with Moore’s Law, and the semiconductor industry needs a new alternative solution. In order to achieve function, shape and manufacturing cost advantages, advanced packaging and system-in-package (SiP) technology has become a trend, and more advanced systems The integrated approach improves the overall electrical, mechanical and thermal performance of the package.

The structure of advanced packaging poses new challenges to semiconductor equipment and materials. There are two main problems. One is that the precision of high-density packaging has been improved by an order of magnitude, and there are also problems of heat dissipation and thermal expansion of materials. Second, advanced packaging is based on different IP routes, and the packaging forms are varied, requiring the support of a large number of customized equipment.

Among them, the Die Bond die bonding machine for SiP packaging has been monopolized by foreign companies for a long time. Recently, Plasyn joined hands with Xunxin (a wholly-owned subsidiary of Foxconn) to jointly develop, combining the expertise of Plasit and Xunxin in chip packaging technology, and released the SiP system-in-package equipment – high-precision die bonder DA801S, It is suitable for SiP, CSP and other packaging forms, with a mounting accuracy of ±15μm, an angle accuracy of ±1°, a high concentration of multiple chips, and the thinnest chip thickness of 50um, which solves the current domestic SiP packaging. The pain point of relying on expensive imported equipment has been Recognized by major companies such as Xunxin.

Join hands with Xunxin, Plasign released SiP system-in-package equipment DA801S

Xunxin (a wholly-owned subsidiary of Foxconn)

In the future, with the rapid development of technologies such as 5G communications, the Internet of Things, and artificial intelligence, higher requirements will be placed on the size, power consumption and cost of chips. The largest segment of SiP is mobile and consumer. As the technology matures, wearable devices, TWS Bluetooth headsets, and smartphones have become the biggest beneficiaries of SiP. According to statistics, the global SiP market is $8 billion in 2020 and is expected to reach $11 billion in 2024, with a compound annual growth rate of 9.5%. In the future, with the development of advanced packaging and system-in-package (SiP) technology, domestic semiconductor equipment and materials will usher in broad development prospects.

It is reported that Presin was established in 2017, with its headquarters and production center located in Dongguan, with subsidiaries in Shenzhen, Suzhou and Hong Kong. It is a high-end equipment platform enterprise in China with completely self-developed motion controllers, servo drives, linear Underlying core technology platforms such as motors and machine vision, relying on its own underlying core technology platforms and combining specific processes, it has developed two product lines of high-end semiconductor packaging equipment and ultra-precision winding equipment, which are IC packaging, optical communication packaging, MiniLED packaging, chip Inductors and other industries provide high-end equipment and intelligent solutions.

Join hands with Xunxin, Plasign released SiP system-in-package equipment DA801S

Enlarged view of SiP packaging microscope

In the field of IC packaging, Plasyn’s 8-inch/12-inch IC die bonder covers a variety of packaging forms with relatively high technical requirements such as QFN, DFN, SiP, etc. It has become a mainstream packaging company, and has been recognized by domestic and foreign packaging and testing companies such as Foxconn, Fuman, Hongguang, and Jiequn.

In the field of optical communication, Plasign’s high-precision COB die bonding machine has a placement accuracy of ±3μm, an angle accuracy of ±0.3°, and an output per hour (UPH) of 800, breaking the monopoly of foreign technology and completely comparable to international leading equipment. , which is specially designed for high-precision packaging products such as optical modules and silicon photonics, and has been recognized by customers in the optical communication industry such as Huawei, Luxshare, Mingpu Optoelectronics, and Alpha.

In the field of MiniLED packaging, Plasign’s MiniLED flip-chip COB mass transfer device XBonder has a placement accuracy of ±15μm and a UPH of 180K. This device and Apple’s backlight products use a similar flip-chip COB thorn crystal process, and have It has independent intellectual property rights and is expected to be officially commercialized this year.

Since its establishment, Pleasant has attracted the attention of investment institutions in the industry, and has completed three rounds of financing, with a cumulative financing amount of more than 250 million. It has successively won the “2019 Winning in Dongguan Science and Technology Innovation and Entrepreneurship Competition Grand Prize”, “2020 China’s Top 50 Most Valuable Investment Enterprises”, “2020 China’s Top 50 Most Potential Enterprises on the Science and Technology Innovation Board”, “2020 Fast-growing Enterprises- High-tech Golden Globe Award” and many other honors. As a representative enterprise of high-end semiconductor equipment in China, Plasyn will accelerate the domestic substitution of semiconductor packaging equipment, and is determined to build a leading enterprise in domestic semiconductor packaging equipment.

The Links:   NL10276AC30-01A LTM150XO-L01

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