Archive 07/31/2022

Apple: Mandatory use of USB-C will stifle innovation

USB Type-C is a USB interface shape standard. It has a smaller volume than Type-A and Type-B. It can be applied to the interface of both PC (master device) and external devices (slave devices, such as mobile phones). type. USB Type-C has 4 pairs of TX/RX split lines, 2 pairs of USBD+/D-, a pair of SBU, 2 CCs, and 4 VBUS and 4 ground wires.

To understand the principle of Type-C, you must first understand its PN definition. The Type-C port has 4 pairs of TX/RX split lines, 2 pairs of USBD+/D-, a pair of SBUs, 2 CCs, and 4 more VBUS and 4 ground wires.

Of course, if the receiving end only needs the DP signal and does not need the USB 3.1 signal, then the DP can use all 4 pairs of TX/RX differential lines for output, so as to achieve up to 4lanes of DP output, providing a total output bandwidth of up to 32.4Gbps (each The lane can output 8.1Gbps), easily realize 5Kx3K60 frame video, even up to 8K×4K 60 frame video (4:2:0 data), this mode is DPonly mode. In addition, in order to be compatible with USB2.0, Type-C also retains USBD+/D- signals for USB 2.0 devices, so just use Type-C interface, USB2.0 and even USB 1.0 devices can also support front and back insertion. It is worth mentioning that the DP+USB2.0 mode can be realized by using USBD+/D- in conjunction with the above DP only mode. DP occupies 4 pairs of TX/RX differential lines, USB only uses D+/D-. Under normal circumstances, the USB2.0 differential signal will only be connected to one side, because the USB Type-C Plug does not have B6 and B7. USB3.1 only uses 2 pairs of TX/RX differential lines as data lines. Connect TX1/RX1 when plugging forward, and connect TX2/RX2 when plugging backwards. It can be seen that in any case, there will be 2 pairs of differential lines that are not used. Yes, the DP alternate mode is to load the DP signal on the two pairs of “excess” differential lines, so as to realize the simultaneous operation of USB 3.1+DP.

In theory, the USB-C port has a maximum transfer rate of 10GB per second. But Apple says the new MacBook’s USB-C port has a maximum transfer rate of 5Gbps. The maximum output Voltage is 20 volts, which can speed up the charging time. And USB-A, so far the limit transfer rate is 5Gbps, the output voltage is 5V.

USB-C can be compatible with the old USB standard, but users need to buy an additional adapter to complete the compatibility. Apple said that not only does Apple officially sell adapters, but third-party companies can also authorize production.

Apple: Mandatory use of USB-C will stifle innovation

Before the advent of Apple’s lightning interface, we may have never thought that the input/output (I/O) interface can be plugged in either front or back. With the arrival of the Type-C connector, all this will change, even if the popularity speed is destined to be Very slowly, but at least this day is not so far away.

Earlier on October 16, Apple said that the European Union’s decision to force the use of the USB-C interface will stifle innovation. The EU denied Apple’s claims, saying the approach was better for consumers and the environment, according to the EU news website.

Anna Cavazzini, President of the EU Consumer Protection Commission, said: “The EU has been pushing for a standard for 10 years that we will no longer need to use a lot of cables, we will only need one. But not all companies agree, and this is the Commission finally universal for chargers The reason why the standard proposes legislation.” In addition, Anna Cavazzini also pointed out: “If a new standard that is better than USB-C emerges, we can adjust the rules.”

Anna Cavazzini said the rule could come into force as early as 2024. Anna Cavazzini said the rule could come into force as early as 2024. It is understood that in September, the European Commission proposed to use the USB-C interface as a universal charging interface for smartphones, tablets, cameras, headphones, speakers, and video game consoles. Apple said the move would be an inconvenience to iPhone users and that it would stifle innovation.

At 1:00 a.m. on September 15, 2021, Apple held a 2021 fall new product launch conference and released the iPhone 13 series of mobile phones, including the iPhone 13 mini, iPhone 13, iPhone 13 Pro, iPhone 13 Pro Max four models, fast charging Compared with previous models, the performance has been improved to a certain extent, and the PD fast charging charger is not equipped.

The appearance ID of the iPhone 13 series is similar to that of the iPhone 12 series, both of which are flat screen designs with vertical borders, using super-ceramic crystal screen panels, and the top bangs are reduced by 20%, supporting IP68 protection level. In terms of performance, the latest generation A15 bionic processor is adopted, the internal structure is optimized to carry a larger capacity battery, and it supports 15W MagSafa magnetic wireless charging. The battery life performance has been improved to a certain extent. The Pro model supports up to 120Hz adaptive high-speed brush. The maximum capacity of iPhone 13 and iPhone 13 mini is 512, and the maximum capacity of iPhone Pro and iPhone Pro Max is 1TB.

Check the iPhone 13 details page on Apple’s official website, and pull to the bottom of the package. You can see that there is only one mobile phone in the package, and one USB-C to Lightning fast charging data cable. The charger and headphones are not delivered. Let’s take a look at the flagship iPhone 13 Pro series. The package also includes only one mobile phone and one USB-C to Lightning data cable. Headphones and chargers are also not included.

In recent years, domestic Android manufacturers can be described as “crazy output” in terms of electric power. At present, the mainstream charging power is only around 50W, but domestic Android directly soars wired electric power to more than 120W, and wireless charging also reaches 50W. Adding the total wireless power to 200W+ is probably not a problem!

According to the news from the Financial Associated Press, at present, OPPO, Xiaomi, vivo, realme and other mobile phone manufacturers have launched 120W fast charging solutions, and some companies have achieved commercial use, and the fastest battery charging speed can reach 13 minutes!

On the other hand, Apple, the latest generation of iPhone 13 Pro Max supports up to 27W fast charge, which is not a little worse than the Android next door!

In fact, the iPhone can reach a charging power of 27W, which can be said to be “exhausted”. In other words, the power of 27W is basically the limit of Apple’s charging interface!

Why do you say that? Because the iPhone still uses the Lightning interface of the old design!

Apple’s earliest interface was the “30-pin” interface in the iPhone4S era. Later, in order to meet diverse transmission needs and more convenient plugging and unplugging, it was replaced by the Lightning interface that has been used today. The Lightning interface was originally used in the iPod Touch 5. Used on the iPhone 5, it is already an “old antique” design!

In fact, the iPhone can reach a charging power of 27W, which can be said to be “exhausted”. In other words, the power of 27W is basically the limit of Apple’s charging interface!

Why do you say that? Because the iPhone still uses the Lightning interface of the old design!

Apple’s earliest interface was the “30-pin” interface in the iPhone4S era. Later, in order to meet diverse transmission needs and more convenient plugging and unplugging, it was replaced by the Lightning interface that has been used today. The Lightning interface was originally used in the iPod Touch 5. Used on the iPhone 5, it is already an “old antique” design!

It should be noted that some media said that Apple is reluctant to give up the Lightning interface because it does not want to lose a lot of licensing fees.

It is reported that third-party Apple accessories generally need to purchase special chips from Apple and obtain MFi authorization. Once USB-C is used and PD charging standard is adopted, most PD chargers and dual-C port data cables on the market will be used directly. By removing the MFi license, Apple will lose a fortune.

The EU emphasizes that unifying USB-C will enhance environmental protection and save users about 250 million euros a year.

Because the USB-C interface is a new type of interface, there will still be some problems with device compatibility in the future. Before the interface is popularized, users still need to use various conversion devices to convert the interface to be able to use it smoothly. For example, USB-C to USB Adapter converter, USB-C Digital AV Multiport Adapter (HDMI converter), USB-C VGA Multiport Adapter (VGA converter), in terms of power supply, a USB-C power adapter is also required.

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Interpretation of “Special Action Plan for the Improvement of Manufacturing Design Capability”

In order to effectively improve the design problems in the field of manufacturing shortcomings, enhance the design capabilities of the manufacturing industry, and support the construction of a strong manufacturing country, the Ministry of Industry and Information Technology has joined forces with the National Development and Reform Commission, the Ministry of Education, the Ministry of Finance, the Ministry of Human Resources and Social Security, the Ministry of Commerce, and the State Administration of Taxation. , the State Administration for Market Regulation, the National Bureau of Statistics, the Chinese Academy of Engineering, the China Banking and Insurance Regulatory Commission, the China Securities Regulatory Commission, and the State Intellectual Property Office have compiled and issued the “Special Action Plan for the Improvement of Manufacturing Design Capability (2019-2022)” (hereinafter referred to as the “Action Plan”). “). The relevant contents of the Action Plan are now interpreted as follows.

make background

In recent years, the Ministry of Industry and Information Technology, together with relevant departments, has actively promoted the innovation and development of industrial design, carried out a series of work, and achieved certain results. At present, with the advent of a new round of scientific and technological revolution and industrial transformation, many changes have taken place in the connotation and extension of industrial design. At the same time, insufficient design capability has become one of the bottleneck problems and important factors affecting the transformation and upgrading of the manufacturing industry. Basic research and data accumulation, design tools and methods, design talent training, experimental verification, and public service capabilities still need to be strengthened. To this end, we have carried out investigations and researches, and have organized many forums and discussions with local authorities, industry organizations, scientific research institutions, colleges and universities, and design companies. Focusing on the implementation of the relevant requirements for the construction of a strong manufacturing country, aiming at the design problems in the field of manufacturing shortcomings, it is proposed to carry out a special action to improve the design capabilities of the manufacturing industry.

total requirements

The “Action Plan” proposes that, guided by Xi Jinping Thought on Socialism with Chinese Characteristics for a New Era, fully implement the spirit of the 19th National Congress of the Communist Party of China and the Second and Third Plenary Sessions of the 19th Central Committee, adhere to the new development concept, and follow the requirements of building a modern economic system. Supply-side structural reform is the main line, focusing on the shortcomings of the manufacturing industry, continuously improving the industrial system, improving public services, enhancing design levels and capabilities, and promoting the transformation from Chinese manufacturing to Chinese creation, Chinese speed to Chinese quality, and a manufacturing power. Transforming to a manufacturing powerhouse provides support and guarantee for the high-quality development of the manufacturing industry.

Overall objective

On the basis of adhering to the basic principles of market-led, innovation-driven, overall coordination, and point-to-point, the Action Plan proposes to spend about 4 years to promote the effective improvement of design problems in the field of manufacturing shortcomings, and to gradually complete the basic research system of industrial design. , the public service capacity has been greatly improved, and the talent training model has been innovatively developed. Achieve breakthroughs in original design in high-end CNC machine tools, industrial robots, automobiles, power equipment, petrochemical equipment, heavy machinery and other industries, as well as in energy conservation and environmental protection, artificial intelligence and other fields. A number of industry and national standards have been formed in system design, artificial intelligence design, ecological design, etc., and a number of easy-to-use and professional design tools have been developed. High-level construction of the National Industrial Design and Research Institute, improve the basic research capacity of industrial design and the level of public services. Create about 10 service-oriented manufacturing demonstration cities featuring design services, develop and expand more than 200 national-level industrial design centers, build the backbone of design innovation, and lead the development trend of industrial design. Promote the “new engineering” education model of industrial design, innovate the way of training design talents, and create about 100 manufacturing design training bases.

key tasks

In view of the design problems in the field of manufacturing shortcomings and the outstanding problems affecting the development of design innovation, 5 major tasks and 13 measures are proposed. One is to consolidate the foundation of manufacturing design. It is proposed to intensify basic research and develop advanced and applicable design software. The second is to promote design breakthroughs in key areas. It is proposed to make up for the shortcomings of equipment manufacturing design, improve the design level of traditional advantageous industries, and vigorously promote system design and ecological design. The third is to cultivate high-end manufacturing design talents. It is proposed to reform the training mode of design talents in the manufacturing industry and unblock the development channel of designer talents. The fourth is to cultivate and expand the main body of design. It is proposed to speed up the cultivation of the backbone of industrial design and promote the professional development of small and medium-sized design enterprises. Fifth, build a public service network for industrial design. It is proposed to improve the industrial design research service system, build a design collaboration platform for co-creation and sharing, strengthen the protection of design intellectual property rights, and create a social atmosphere conducive to design development. Focusing on various tasks, the Action Plan proposes key design software iterations, key design breakthroughs, manufacturing design talent cultivation, SME design innovation, industrial design public service system construction, industrial design intellectual property protection and rights protection, etc. project, clarify specific requirements, and increase the operability of the action plan.

Safety precautions

The Action Plan proposes four safeguards in terms of organization and coordination, policy guidance, investment and financing channels, and policy publicity to ensure the smooth implementation of various tasks. In terms of organization and coordination, the Action Plan proposes to establish a working mechanism for the overall coordination and joint promotion of relevant departments. Relevant departments in various places shall, in light of the actual situation, deploy and implement work tasks. Relevant industry organizations and social institutions should participate extensively and jointly implement various task arrangements. In terms of policy guidance, the Action Plan proposes to revise the policies to promote the development of industrial design and expand the connotation and extension of design. Utilize the existing channels and major projects of relevant departments to support the improvement of manufacturing design capabilities.Income from technology transfer, technology development and related technology consulting and technology services provided by enterprises can enjoy relevant tax in accordance with national tax laws.

receive preferential policies. Strengthen industry statistical monitoring. In terms of investment and financing channels, the Action Plan proposes to encourage social capital to set up design industry funds. Encourage qualified design companies to go public for financing. Banks and other financial institutions are encouraged to provide personalized services to design enterprises, and to broaden the scope of collaterals. Guarantee institutions are encouraged to set up special types of guarantees, and to increase credit guarantee support for design enterprises and design innovation projects. In terms of policy publicity, the “Action Plan” proposes to vigorously publicize outstanding achievements in the field of design, events, key enterprises and leading talents. Strengthen the publicity of design intellectual property protection, and enhance the awareness of integrity management. Continuously expand the social influence of design innovation, and create a good atmosphere in which the whole society attaches importance to design and promotes design development. (Department of Industrial Policy, Ministry of Industry and Information Technology)

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Huawei Honor applies for three new trademarks, and there is another big move?

With the development of 5G, AI and other technologies, it has become more and more common for some technology companies to enter other fields. Alibaba makes chips and Gree manufactures mobile phones. Each company is constantly improving its business in order to satisfy consumers in many aspects. need. Recently, some netizens discovered that Huawei Honor has applied for three new trademarks, which are “Honor Home”, “Honor Go” and “Honor Work”. From these names, it is not difficult to see that Honor is likely to launch products designed for home, smart wear and office fields in the overseas market.

At present, Honor has many products in the above fields. For example, in terms of home use, smart body fat scales and Honor routers, and in the field of smart wear, Honor has also launched Honor Watch, Honor Band and other products. And on November 26, Honor will hold a new product launch conference in Beijing. In addition to the new flagship Honor V30 that everyone is looking forward to, more Honor smart hardware products will also be unveiled.

Honor wireless charger

The Honor wireless charger adopts a circular design. The material above the charger is similar to textile, and it also has a cross-shaped non-slip rubber, which should be to prevent the phone from falling during charging. It is reported that this wireless charger supports up to 40W fast charging, which is consistent with the previous 3C certification information. According to online reports, in order to surpass its rivals, Honor’s wired and wireless algorithms have been changed to shorten the trickle charging time. In the appointment interface of the Honor V30 series, the new Honor wireless charger has been opened for appointment simultaneously.

Honor Smart Body Fat Scale 2

The Honor Smart Body Fat Scale 2 retains the white body color scheme of the previous generation, but has made some innovations in the body design. The middle is composed of 4 arc shapes to synthesize a silver circular pattern, tempered glass is used as the bearing surface, and the bottom is made of plastic. Material. This product will still retain the measurement of key body indicators such as BMI (body mass index), body weight, body fat rate, water rate, etc. of the previous generation scales. In addition, the “electrocardiogram” logo in the poster is also particularly eye-catching. , which may indicate that the heart rate monitoring function of the Honor Smart Body Fat Scale 2 will be greatly improved!

glory hunter router

So far, Honor has a number of routers on sale, and has been unanimously recognized by the market and consumers for its good signal and fast speed. As the domestic e-sports market develops faster and faster, there will be a great breakthrough in the output value of this field, with broad development prospects. Honor also saw this opportunity and launched e-sports routing products.

Previously, Xiong Junmin, vice president of Honor products, published a popular science article on Zhihu – “Old Bear Science: Why is the Wi-Fi signal very good, and occasionally lags when playing games”, the main selling point of the Honor Hunter game routing is also Expose accordingly. In general, in addition to the hexagonal cutting design and the appearance of the wrap-around light effect, the Honor Hunter game router has the main attraction points – chip-level Wi-Fi dual-link transmission, mobile game acceleration mode and game-specific X-antenna, dedicated gaming Wi-Fi path, these are new features designed around improving Wi-Fi signal and gaming latency.

The Honor Hunter router supports Game Turbo dual-channel game acceleration. Officials say that it can greatly reduce packet loss. It also supports Game Mode and mobile phone acceleration mode upgrades. It can identify 3,000 mobile games, and has a built-in Xunyou Accelerator that supports host and PC acceleration. , this router is also on the shelves.

HiLink connects the smart home

Compared with Xiaomi, Huawei entered the game later, but developed faster. At the end of 2015, Huawei officially released the HiLink strategy for smart homes, trying to connect more brand products to create an IoT ecosystem.

The Huawei HiLink smart home developer platform takes the HUAWEI HiLink protocol as the core and pushes the protocol to partners, so that smart devices of third-party cooperative brands can be connected to Huawei IoT. Through protocol conversion, Huawei routers can maintain an ecosystem with a plug-in application, and every ecological smart device may become part of Huawei’s smart home.

According to Huawei’s performance report for the first half of 2019, Huawei’s HiLink ecosystem has brought together 260+ brands, covering more than 500 products, and has 30 million+ users.

1+8+N, realizing the interconnection of all things

As a leader in the global 5G industry, Huawei actively undertakes the responsibility of promoting the Internet of Everything to become a leader in the smart Internet, and proposes a “1+8+N” all-scenario strategic layout to help developers and partners accessing Huawei’s terminal cloud services accelerate application innovation.

Among them, “1” represents a smartphone; “8” represents 8 auxiliary entrances; “N” represents other IoT devices. The smartphone is the main entrance, and eight auxiliary entrances are used, including tablets, PCs, TVs, in-vehicle devices, smart influencers, smart headphones, smart watches, smart glasses, etc., to connect many IoT devices, including smart travel, audio-visual entertainment, Sports health, smart home, etc. Huawei has the confidence and ability to do a good job in the interconnection of all devices, so that users can manage all devices through several portals, and finally realize the Internet of Things era where everything is interconnected!

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Xu Ziyang, President of ZTE: Root down, grow in the sun, and build a digital rainforest

On February 23, the opening ceremony of Mobile World Congress Shanghai was officially held at the Shanghai New International Expo Center. Xu Ziyang, President of ZTE, attended and delivered a keynote speech entitled “Rooted Down, Grows in the Sun”.

Xu Ziyang pointed out that at present, 5G is still in the introduction stage, and the challenges of “deterministic technology” and “uncertain business” coexist. The challenges of “deterministic technology” include the ultimate user experience, network cost reduction and efficiency improvement, and special capability requirements of the industry. We advocate rooting down with ingenuity, continuous innovation and breakthrough, and creating value. The challenge of “uncertain business” mainly refers to the scale, monetization, business model and so on of industry applications. In this regard, we advocate building “agile” cloud network capabilities to better support light innovation and rapid iteration. At the same time, we also advocate open cooperation between industry and ecological partners to establish a deeper level of atomic capabilities and grow together.

– Full text of speech –

The longest-lived grass on the grassland is Sharp thatch. It is thin and short when it first germinates, and in the first half of the year, the stem is only about an inch, but its roots go deep into the ground for more than ten meters, and spread wildly around. , absorb nutrients, store energy, and are ready to go. Once it rains, it can grow to about two meters in three to five days. The topic of my speech today is “Root Down, Grow in the Sun”, build a digital tropical rainforest, and achieve symbiosis, common wisdom and win-win results. In fact, I want to share the innovation, practice and thinking of ZTE in the past period of time, and advocate that during the 5G introduction period, everyone should work together to create a better future.

The wave of digital intelligence is coming

The past 2020 can be described as “extraordinary”. The sudden outbreak of the epidemic and the unpredictable global political and economic situation seem to disrupt the rhythm of the original 5G global deployment. pace, especially China. Anti-epidemic technology has become a bright color in those gloomy days.

For consumers, the epidemic has also changed the way of life and work to a large extent. Our demand for ICT services has become more indispensable like air, water and electricity. For enterprises, digital and intelligent transformation is not limited to reducing costs and improving efficiency, but to make enterprises more agile and intelligent, so as to better cope with uncertainties from the outside world, market, technology, etc.

After nearly two years of 5G commercial practice, 5G is still in the introduction stage, but the wave of digital intelligence has become irresistible. We still maintain the judgment that this stage of development will still face the coexistence of “deterministic technology” challenges and “uncertain business” challenges. The challenges of “deterministic technology” include the continuous cost reduction and efficiency improvement of 5G networks, the special capability requirements of different applications in the industry, etc. These issues are relatively clear. The “uncertainty business” challenge mainly refers to a series of issues that are not yet fully clarified, such as the scale, monetization, and business models of innovative applications in the industry.

Take root in certainty and pursue the ultimate

For deterministic technical challenges, we advocate rooting down and pursuing the ultimate. First, in combination with the pace of market advancement, let’s take a look at the trend of cloud network capability evolution.

The first stage can be understood as the 1-3 years in the initial stage of 5G network deployment. In this stage, “convergence and efficiency improvement” is the focus, and higher resource efficiency is achieved through multi-frequency and multi-standard, large bandwidth and high power, DSS, etc.; New materials, new processes and AI continue to save energy and reduce consumption. Uplink enhancement, edge deployment, and multi-cloud collaboration help to explore and expand the industry market. The second stage focuses on “intelligent openness”. With the increase of 5G network load, AI will be more comprehensively applied, the architecture will be further open and decoupled, edge cloud and industry applications will be fully rolled out, which promotes the deep integration of cloud and network, and at the same time millimeter wave, etc. Applications such as greater bandwidth and uRLLC are also starting to expand. In the third stage, with the popularization of applications, more requirements for cloud network capabilities are put forward, and the evolution to next-generation technologies is initiated. Ultra-large-scale antennas, terahertz, 3D links, and AI native have begun to emerge.

For the first aspect of “rooting down”, we advocate continuous innovation and breakthroughs focusing on the ultimate customer experience. Whether for the To C or ToB market, the fundamental of market success is to let end customers feel a truly differentiated experience compared to the previous cloud network capabilities.

For example, for consumers, the Massive MIMO broadcast beam SSB 1+X solution can further improve the vertical coverage of complex scenarios by 30%; eDAS, based on the old DAS system, realizes uplink/downlink multi-stream MIMO transmission through software, which is low-cost. Realize indoor 5G experience; Doppler frequency shift compensation technology can ensure customer experience in high-speed environments such as high-speed rails and airplanes; and the new “Four Views” for families also enable home users to enjoy the immersive experience of the stadium or concert .

For industrial applications, both 5G uplink enhancements and low-latency PONs can provide better access means, supplemented by end-to-end deterministic guarantees and slice enhancements, greater bandwidth, lower latency, and Better reliability guarantees better support for enterprise applications, especially OT (production) domain application expansion.

Second, we advocate the continuous pursuit of ultimate efficiency. The ultimate efficiency includes the ultimate spectrum efficiency, the ultimate energy efficiency, and the ultimate network operation efficiency, which are crucial for operators to reduce costs and improve efficiency, as well as sustainable development.

For example: MU-MIMO dedicated to higher capacity; Cloud Radio dedicated to lower interference; SuperDSS capable of supporting 2/3/4/5G full-mode spectrum dynamic sharing; single-wavelength 800G OTN supporting higher spectral efficiency; AIVO It focuses on improving efficiency through the introduction of AI in all stages of planning, construction, maintenance and optimization; PowerPilot achieves site-level and refined power saving by introducing big data and AI applications. After the 5G network load is increased, it can also identify services and analyze the energy efficiency ratio of services in real time. Through in-depth coordination between frequencies and standards, a better energy efficiency ratio of the entire network can be achieved without affecting the user experience.

The ultimate hard core underlying capabilities are the foundation for continuous innovation for “extreme experience” and “extreme efficiency”. In terms of chip design, advanced manufacturing process, advanced packaging and better software and hardware co-design will help us break through the bottleneck of Moore’s Law failure. The core competitiveness of capabilities in chips; algorithms are the soul of software and the key to improving software quality and efficiency. We will focus on high cohesion at the basic layer, the network layer will focus on the ultimate commercial experience, the service layer will focus on feature optimization, and continue to enrich and strengthening the AI ​​algorithm library; if the chips and algorithms are continuously improved, then the architecture can bring revolutionary progress. We will continue to deepen the multi-dimensional decoupling, promote the micro-service architecture on a larger scale, truly realize data-driven, and provide AI Native evolution.

Build agility in uncertainty and grow in the sun

For various uncertainties in industry market development, we advocate building “agility”, that is, to promote digital and intelligent transformation for industry customers. We can provide such a cloud network capability: supporting low-cost innovation, rapid trial and error iteration, one-point Successful and rapid replication; at the same time, we also hope that industry and ecological partners can better open and cooperate to grow together.

For industry expansion, we advocate value-driven, focus on scenarios, and “make things EASIER”. Through heterogeneous homologous and cloud-native software design, application elasticity, sensorless migration and flexible combination are realized, namely “Elastic”; through lightweight software and hardware design, it supports computing power, agile innovation, rapid iteration and replication, namely “Agile”; build a higher-standard security guarantee through the endogenous security of zero trust, namely “Secure”; realize data-driven and continuous iterative optimization of algorithms through ubiquitous AI; simpler and faster deployment and maintenance methods allow customers to be more “Easy”; better delay certainty and resource certainty are guaranteed through TSN and small-grain hard slicing, that is, “Reliable”.

In the world of martial arts, only fast is not broken. “Agility” is the core of coping with uncertainty. The premise of agility is lightness, that is, light weight and flexibility. At the same time, due to the in-depth expansion of industry applications to OT (production domain), the edge will become an innovation incubation and innovation platform. The main battlefield of the application. In terms of agile edge deployment support: at the hardware level, from on-site gateways, embedded boards, integrated cabinets to resource pools of a full range of servers, starting with light weight and expanding on demand; at the software level, the TCF cloud base uses lightweight, Neo hardware Acceleration, dual-core, etc. will further strengthen the technical service layer and activate the computing power of the entire network. Software and hardware collaboration enables flexible deployment of Anywhere, Anysize, and Anyservice, and agile innovation.

To deal with uncertainty, rapid iteration is also required, and global strengthening and coordination are also required. Here, we propose “full decoupling”, “double loop” and “deep optimization”.

“Full decoupling” hopes to further deepen decoupling from the perspective of the cloud. The deepening of horizontal decoupling is reflected in the componentization of small particles, and the vertical decoupling focuses on further decoupling the technical service layer and general business layer of the PaaS layer. Based on this, a “dual cycle” can be built. On the one hand, the technical service layer and the underlying resource cycle are optimized to continuously improve the efficiency of infrastructure resources and the synergy efficiency of upper-layer applications, so as to better ensure the application effect of resource-constrained edge scenarios; On the one hand, the general business layer can innovate and iterate with the scenario application. The low-code architecture of the general business layer can empower the upper-layer business development upwards, while the scenario application can realize the precipitation and optimization of the core business logic and algorithms downwards, to a certain extent. to resolve the conflict between customization and scale. “Deep optimization” focuses on multi-modal integration, reduces ineffective redundancy overhead, and achieves the best efficiency of infrastructure in different types of applications by customizing general-purpose hardware.

Constructing Digital Intelligence Tropical Rainforest Symbiosis, Co-Intelligence and Win-win

Tropical rainforest is the most resistant and stable ecosystem on earth. In the 5G era, I also hope to advocate colleagues in the industry to take root and grow in the sun. At the same time, they can work together to build a digital tropical rainforest and realize symbiosis, symbiosis and common wisdom. win.

In the uncertainty, everyone needs to stay warm, and the industry and ecology need more detailed professional coordination. We advocate the openness of atomic capabilities, strong links, efficient collaboration, and the construction of a digital and intelligent tropical rainforest to achieve symbiosis, mutual intelligence and win-win results. In the decade of mobile communication, ZTE has also consistently worked with the industry and industry partners to change lives, change society, and promote the progress and development of global science and technology through unremitting efforts and innovations. Whether in underlying capabilities such as chips, databases, operating systems, end-to-end ICT product capabilities in wired, wireless, computing power facilities and terminals, component capabilities such as AI, data, and video, and 5G application innovation, ZTE is committed to Willing to open its various atomic capabilities to industry and ecological partners. Last year, we even put forward the self-positioning of “digital economy road builder”, insisting on doing the hardest and most difficult things, aiming to inject the heart of 5G into the world.

This year is the Chinese Year of the Ox, and the ox represents tenacity and perseverance. ZTE will insist on taking one step at a time, integrating knowledge and action, and keeping words, faith and deeds. I also firmly believe that with the joint efforts of the entire industry, we will definitely be stronger than the difficulties and challenges we face. thank you all!

  

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“Suggestions of the Two Sessions” Kuang Guangli of Anhui University: Taking advanced materials and technologies of integrated circuits as the main direction for the construction of first-class disciplines in Anhui University

According to Anhui.com, at this year’s National People’s Congress, Kuang Guangli, a member of the National Committee of the Chinese People’s Political Consultative Conference and president of Anhui University, said that it is necessary to promote the construction of high-level universities in a classified manner, build a high-quality higher education system, and support the construction of places where conditions permit. A basic subject research center with a scientific device as the core.

“Take advanced materials and technologies of integrated circuits as the main direction of the construction of first-class disciplines in Anhui University, and build a world-class material science research platform.”

Kuang Guangli suggested that the construction of large scientific installations should proceed from the actual needs of basic scientific research. It must be clear in which frontiers breakthroughs are to be sought and what conditions are required to achieve these breakthroughs. It is necessary to further release large scientific devices to serve basic discipline research. Support qualified places to build basic discipline research centers with large scientific installations as the core, and create a number of highly open and international “special zones” for basic research and development.

It is reported that Anhui University aims at the key development and innovation fields of Anhui Province, deeply integrates into the construction of Hefei Comprehensive National Science Center, focuses on the cultivation of national key laboratories and “research on advanced materials and technology of integrated circuits” and other “stuck neck” technologies, and introduces disciplines on a large scale. Leading talents and young top-notch talents to form a high-level innovation team.

“I hope Anhui’s science and technology will develop better, and it can catch up with or even surpass the world’s best level, especially in some areas through efforts to achieve ‘overtaking on a curve’.” Kuang Guangli said, “Currently integrated circuit technology, as a new material and a new technology Technology, very valuable, can bring about huge changes in the entire industry, and the benefits are also huge.”

Kuang Guangli said, “Anhui University has chosen integrated circuit materials and technology as its main direction to build a world-class research platform for materials science. Cultivate talents on the best integrated circuit technology research platform, and use these disciplines to carry out technological exploration. The development of the electronics industry provides new technologies and delivers outstanding talents.”

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Intel promotes information technology innovation from cloud to end to create smart education

In recent years, China has introduced a series of educational policies to help promote the development of modern education in an all-round way. In 2018, the Ministry of Education issued the “Education Informatization 2.0 Action Plan”, proposing the goal of “three completes, two highs and one big”, striving to build a new model of talent training under the condition of “Internet +”, develop a new model of Internet-based education services, and explore information The new model of education governance of the times. In 2019, the Central Committee of the Communist Party of China and the State Council issued “China’s Education Modernization 2035”, which pointed out that education should pay more attention to everyone, pay more attention to teaching students according to their aptitude, pay more attention to integrated development, and pay more attention to joint construction and sharing. Point out the direction for opening a new journey of educational modernization in the new era.

With its years of understanding of educational reform and its advantages in cloud-to-end hardware, software optimization, system development, development tools, solutions, and industry leadership, Intel firmly believes that innovation and change are the driving forces for the development of education. Intel hopes to use information technology to improve teaching informatization and empower educational innovation. Through Intel’s powerful capabilities in computing power, storage, artificial intelligence, big data, Internet of Things, and 5G, it empowers smart education environments, resource governance platforms, quality education practices, and blended learning models to promote the efficiency, equity, and individuality of education. The development of informatization makes informatization truly serve education.

Education informatization faces challenges

Under the vigorous promotion of relevant national policies, accelerating the innovative application of information technology and intelligent technology in the field of education, and building ubiquitous, flexible and intelligent smart classrooms, online classroom environments and application models are becoming mainstream. At the same time, in the overall construction process, smart teaching also puts forward higher requirements for technology.

From the software and hardware of the smart teaching system:

Stronger storage and higher security are required. Smarter classrooms will collect more and more information, which includes multimedia data such as video/audio, which requires real-time and long-term preservation. In particular, the rapid growth of data volume after normalized recording and broadcasting puts forward higher requirements for storage; at the same time, privacy protection of data collection is also an important requirement that must be considered in future smart classroom solutions.

Need higher performance. Smart classrooms need to support many application scenarios with strong computing/multimedia processing, such as 2D or 3D CAD applications, multi-channel video capture, decoding and encoding, AR/VR applications, etc. Performance requirements are getting higher and higher.

Greater load capacity is required. The application scenarios in smarter classrooms are very rich, from simple exams, teaching to in-depth multimedia information Display. These loads need to be integrated into one system instead of forming multiple isolated islands. Therefore, the need for a reliable solution to support WLC ( workload consolidation ) in smart classroom application scenarios becomes more urgent.

A more complete network and wireless routing connection is required. Including the connection from the student terminal to the server, to the Ethernet, to the cloud, and from the teacher terminal to the student terminal, all put forward higher requirements for the network and wireless routing.

From the perspective of smart teaching scenarios:

Interactive features need to be improved. Whether it is a smart classroom or an online classroom, the interaction function between teachers and students still needs to be improved. It not only requires multi-dimensional interaction in the classroom, but also requires the interaction of the online classroom to have the atmosphere of a live class. is approximate.

Teaching efficiency needs to be improved. On the one hand, teachers need to know what students are doing, fully understand the learning situation, and provide support for the whole process of tracing and evaluating teaching effects through artificial intelligence and other technologies; on the other hand, through big data analysis to gain insight into students’ learning needs and promote personalized teaching developing.

Promote education informatization innovation from cloud to end

Intel is committed to continuously introducing innovative technology products to bring more value to customers. The development of smart education puts forward higher and higher requirements for information technology, and the upgrading of information technology will surely promote the development of smart education in many aspects. By continuously promoting technological innovation, and working with partners to deepen the education field, Intel integrates advanced information technology into every link of teaching and management, uses information technology to provide a good teaching interaction and basic teaching environment, and collects teaching information across the board. Behavioral data, course content data and management data in the teaching process are managed and innovated through big data analysis to improve and drive changes in teaching models, drive personalized learning, and achieve true “teaching according to aptitude”.

In order to create an intelligent and interconnected smart teaching environment, video recording and broadcasting in the scope of smart campus/smart classroom and the application scenarios derived from it, such as distance education, dual-teacher classroom, micro-classroom, famous teacher’s lecture and based on For deep learning data analysis, Intel provides a complete and fully optimized overall solution.

In addition to the basic hardware configuration based on IA architecture and rich tools (OPS, VDD, Media SDK, OpenVINO), Intel also provides ICS (Intel Collaboration Suite) developed on the basis of web RTC, which is specially designed for distance teaching. Created software development tools. This tool supports partners in the industry chain to develop personalized products. The interactive software developed based on this development kit can greatly reduce the network delay and support the sharing and interaction of multi-channel videos; meanwhile, it provides optimized real-time switching and analysis based on Intel architecture, open source code and a proven software development kit. The overall video recording and broadcasting solution based on Intel architecture can help users reduce the cost of media application development and optimization by 90%, and can maximize the mobilization of the hardware capabilities of the Intel platform.

Intel Media SDK provides excellent media encoding/decoding/transcoding capabilities and experience based on IA platform;

The modular VDD provides scalability for the ever-enhancing remote teaching, video capture, analysis, storage and other edge computing application scenarios;

OpenVINO provides optimization tools for Al algorithm model based on IA platform;

The open source ICS remote collaboration software package provides the optimal space for real-time interaction, rich media sharing, and video-based data analysis. Support multiple protocols and input/output devices, support multi-point to multi-point video real-time interactive operations, and support single-point to multi-point remote real-time interactive/sharing operations. Provide high-efficiency video stream processing channel: Compared with the general media stream pure software channel, the software package itself can improve the IA-based video stream processing speed by more than 3 times, and has strong support for error packets and packet loss. ;

Intel not only promotes the end-to-end education informatization upgrade, but also supports innovation in the education industry from cloud to end with full-stack strength. One of the cores of future education informatization is data. By focusing on the collection of students’ behaviors in the classroom, management information collection, and teaching courseware content collection, and making full use of these data, data can become the driving force for promoting personalized teaching and educational innovation. Therefore, when large-scale multimedia digital educational resources are collected, their corresponding storage and management become particularly important. A scalable cloud computing platform with resource popularization and management functions, which helps to use big data and artificial intelligence to analyze the corresponding data, and provide personalized teaching through the network.

Public cloud, private cloud, and hybrid cloud solutions built on Intel Xeon Scalable processors, Intel Optane technology, and Intel Select Solutions can provide users with scalability and flexibility, allowing the education industry to innovate on the road Remain competitive. Whether it’s databases, high-performance computing (HPC), artificial intelligence, and the web, you can get higher performance at a lower total cost of ownership in the cloud based on Intel architecture. Cloud-based software powered by Intel technology helps users improve security, compliance and performance while increasing availability. Intel’s active participation in the open source community, including extensive collaboration and innovation, has resulted in an SDI approach that has resulted in hundreds of new, easier cloud solutions.

Build an educational innovation ecological chain with partners

Intel pays attention to the development of China’s education equipment market, especially to make the underlying technical standards and product innovation more suitable for the development of China’s education informatization. In recent years, Intel has built a software and hardware ecosystem for educational informatization construction by continuing to provide strong underlying software and hardware technical support, providing educational application developers and educational equipment users with advanced technical means to meet the needs of the new era. Personalized education needs, so as to achieve the goal of maximizing the efficiency of education.

As a leader in computing innovation, Intel continues to work with upstream and downstream partners in the industry chain to jointly promote the innovative development of educational informatization, and to promote the popularization and application of informatization and IT technology and equipment in the Chinese education market. In the transformation of smarter classrooms, Intel provides standardized computer vision processing solutions and is committed to creating an interactive learning environment to enhance the classroom teaching experience, thereby helping students improve learning efficiency and outcomes. Using Intel’s computer vision processing solutions, a series of innovative smart education applications have been launched, including an interactive tablet based on Intel’s Parallel Pluggable Specification (OPS) that integrates computing, video and sensor centers, and an Intel Visual Data Device (Intel VDD) created edge computing platform, etc.

So far, Intel’s end-to-end solutions for smart education have had many implementation cases. Based on Intel’s end-to-end solution for smart education, Honghe Technology has launched “Smart AI Classroom”. Smart AI Classroom can collaborate with a series of interactive software and hardware devices such as intelligent interactive blackboards, and then use advanced AI technology to realize student face recognition. , and then realize the special functions of AI roll call, AI rush answer, etc., which greatly saves the teacher’s roll call time before class, and comprehensively improves the efficiency of the classroom. In the development process of smart AI classrooms, the combination of Intel CPU and accelerator card can provide strong computing power support for informatization and data transformation in teaching scenarios, and can effectively reduce costs; The solution can effectively improve the deployment efficiency and make the deployment more convenient.

Based on the “Intel Smart Education End-to-End Solution”, Blue Pigeon Group has also launched a smart campus solution. The smart campus solution released by the Blue Pigeon Group adopts the solution of Intel edge server and visual data device (VDD). With the help of Intel VDD architecture, this solution not only makes it possible to intelligently control and diagnose multimedia equipment, synthesize recording and broadcasting images, and extract blackboard writing, but also realize application functions such as multimedia teaching, cloud recording and broadcasting, remote interactive teaching, and remote conferences. , one room has multiple uses, which not only promotes the development of smart classrooms, but also helps realize remote smart teaching.

The seewo smart classroom end-to-end solution consists of Intel® architecture-based cloud, class cloud server, teacher teaching terminal and interactive whiteboard, and Intel Apollo Lake-based student terminal, covering all aspects of before, during and after class. It can ensure the smooth connection in the state of weak or no network, ensure the smooth teaching of classroom teaching, change the traditional teaching method, and create a smart classroom with full participation and interactive generation. Intel’s smart education end-to-end solutions can provide support for different scenarios of smart education, thereby effectively helping the education industry to realize the transformation of smart education better and faster.

At present, with the continuous development of information technology, smart education is changing from emphasizing application-driven and integrated development to focusing on innovation-led and ecological transformation. Intel has always led technological progress and supported the development of education by relying on its advantages in the field of information technology. In order to better promote the construction of a smart education system and realize the vision of “intelligence + education”, Intel continues to promote the innovation of information technology in the field of education with its software and hardware advantages and rich product portfolio and solutions. Intel’s solution starts from three scenarios of smart campus, smart classroom and smart classroom, and can provide end-to-end education solutions covering from the cloud to the terminal, so as to optimize the information infrastructure and edge computing equipment for educational scenarios, improve Data carrying and processing capabilities provide solid support for innovative educational applications. In the future, Intel will work with ecological partners to create an education-wide industry chain model, provide comprehensive and three-dimensional services for education development, adhere to technological innovation, and help create smart education.

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Differences with and without driver source pins and their effects

[Introduction]In the previous article, as a premise to introduce the effect of the driver source pin, we learned about the Voltage during switching operation in a conventional packaged MOSFET without a driver source pin (hereinafter referred to as “conventional MOSFET”). . In this article, together we will understand the operation of a MOSFET with a driver source pin and the effect of the driver source pin.

Key takeaways from this article

・Have driver source pins to eliminate the influence of VLSOURCE on VGS_INT.

・A driver source pin is provided to increase the turn-on speed.

In the previous article, as a premise for introducing the effect of the driver source pin, we looked at the voltage during switching operation in a conventional packaged MOSFET without a driver source pin (hereafter referred to as “conventional MOSFET”). In this article, together we will understand the operation of a MOSFET with a driver source pin and the effect of the driver source pin.

Differences with and without driver source pins and their effects

The lower left figure is a conventional MOSFET driver circuit, and the lower right figure is a MOSFET driver circuit with a driver source pin. The difference is the connection method of the return line of the drive circuit. In the past, the MOSFET was connected to the source (Source) pin, while the MOSFET with the driver source pin was connected to the driver source pin (Driver Source) pin. Its source is a separate Power Source pin. Also, each blue arrow represents the voltage in the switching operation.

Differences with and without driver source pins and their effects

As shown by the blue arrows, both voltages are the same during switching operation. Again, after the MOSFET is applied with VG and turned on, ID increases and LSOURCE produces VLSOURCE in the direction of (I) in the figure. Since the current IG flows into the gate pin, a voltage drop VRG_EXT(I) is generated due to RG_EXT.

As described above, the voltages generated by both are the same. However, in the case of conventional MOSFETs, VLSOURCE and VRG_EXT(I) are included in the drive circuit network during turn-on, so the on-chip required for MOSFET turn-on operation The voltage of VGS_INT will decrease, eventually resulting in lower turn-on speed. In the case of a driver source pin, the ID will flow to the power (Power Source) pin, not to the driver source (Driver Source) pin, this part is not included in the driver circuit network, so the VLSOURCE pair can be eliminated. Effects of VGS_INT.

Differences with and without driver source pins and their effects

If driver source pin is available, it can be removed

Differences with and without driver source pins and their effects

item (=VLSOURCE), it can be seen that this part of the voltage will not affect VGS_INT. This is the effect of the driver source pin, which increases the turn-on speed.

In the next article, we will look at the effect of the driver’s SOURCE pin by working with waveforms.

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Accurate “Drip” Control – Renesas Infusion Pump Solutions

[Introduction]The medical system is very strict in controlling the dosage of medication, but common clinical infusions generally use hanging bottles, relying on eye observation and manual clips to control the dosage and speed of medication, which is a lot of work for medical staff. It may also cause deviations in the accuracy of medication. To solve this problem, Renesas has introduced the infusion pump solution, which is an instrument that can precisely control the number of infusion drops or the infusion flow rate, which ensures that the drug is evenly distributed and delivered to the patient accurately and safely.

Accurate “Drip” Control – Renesas Infusion Pump Solutions

Accurate “Drip” Control – Renesas Infusion Pump Solutions

System Block Diagram

Configuration introduction

At the heart of the Renesas infusion pump solution is the interface-rich 32-bit MCU RA4M2, which uses an efficient 40nm process and uses the TrustZone-enabled high-performance Arm® Cortex®-M33 core. Used in conjunction with the on-chip Secure Crypto Engine (SCE), it can realize the functions of a security chip, which is suitable for IoT applications that require diversified communication functions. In addition, the efficient communication interface of RA4M2 can also be extended to connect touch buttons and LCD Display modules, thus bringing a more intelligent interactive experience to the system.

For motor control, this solution uses the HVPAK programmable mixed-signal matrix SLG47105, a highly versatile device capable of designing multiple mixed-signal functions as well as high-Voltage functions in a tiny and thermally efficient IC. The SLG47105’s integrated dual H-bridge/quad half-bridge function allows it to drive different loads at up to 13.2V, with up to 2A per output. And the advanced PWM macro unit integrated inside the SLG47105 can drive multiple motors with different PWM frequencies and duty cycles. This combination of low no-load current consumption and compact size further expands the application field of the device.

In order to deepen the accuracy of the system, this scheme also adopts the high-resolution position sensor IC ZMID5201 and high-performance operational amplifiers ISL28113 and ISL28130. Among them, the ZMID5201 adopts a smarter approach to position sensing, utilizing low-cost printed circuit coils and simple metal sensing fan blades, eliminating the magnets typically used for position sensors, providing higher reliability and reducing costs. The ISL28113 and ISL28130 operational amplifiers have a wide temperature operating range to meet the temperature environment required for medical applications.

In addition to the aforementioned devices, the Renesas infusion pump solution features the DA16200 ultra-low power Wi-Fi SoC, RAA211412 buck regulator, RAA214250 linear regulator, and ICM7555 general-purpose timer, benefiting from the excellent performance of these devices , the solution has long-term battery life, and can be infused with accurate metering and stable speed, ensuring medical safety.

With the development of science and technology, both traditional medical equipment and daily necessities are developing in a more intelligent direction. In this regard, Renesas Electronics has created a series of successful product portfolios with its rich experience and excellent products, covering medical, automotive, industrial, communications and other fields, and is committed to providing customers with high-performance and cost-effective solutions. Program.

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2019 Q4 global DRAM manufacturer ranking: Samsung fell 5% month-on-month, still ranked first

 

According to the data, in the fourth quarter of 2019, Samsung’s DRAM revenue was US$6.761 billion, down 5% from the previous quarter, and its market share was 43.5%, down from 45.1% in the previous quarter.

SK Hynix’s DRAM revenue in the fourth quarter of 2019 increased by 2.9% quarter-on-quarter to $4.537 billion, accounting for 29.2% of the market, up from 28% in the previous quarter.

Micron’s DRAM revenue in the fourth quarter of last year reached $3.469 billion, an increase of 2.1% from the previous quarter, and its market share was 22.3%, up from 21.5% in the previous quarter.

Nanya Technology’s DRAM revenue in the fourth quarter of last year fell 9.3% from the previous quarter to $430 million, with a market share of 2.8%, down from 3% in the previous quarter.

In the fourth quarter of last year, Winbond’s DRAM revenue was $141 million, down 9.8% from the previous quarter, and its market share was 0.9%, down from 1% in the previous quarter.

As for Powerchip, the company’s DRAM revenue in the fourth quarter of last year was $62 million, down 20.7% from the previous quarter, and its market share was 0.4%, down from 0.5% in the previous quarter.

Overall, in the fourth quarter of last year, global DRAM revenue edged down 1.5% from the previous quarter to $15.535 billion. Except for SK Hynix and Micron, the revenue of other DRAM factories has declined to varying degrees.

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